Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics

Product Details
Customization: Available
Application: Automobile, Construction, Fiber & Garment, Footwear & Leather, Packing, Woodworking
Bonding Function: Instant Adhesive
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  • Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
  • Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
  • Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
  • Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
  • Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
  • Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
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  • Overview
  • Product Description
  • Sepcification
  • Application Scope
  • How to use
  • Company Profile
  • Customer feedback
  • Recommend products
  • FAQ
Overview

Basic Info.

Model NO.
EP330
Color
Translucent Pink
Composition
Epoxy Resin
Morphology
Liquid
Transport Package
Packing
Specification
1kg set
Trademark
CEMEDINE
Origin
Japan

Product Description

Product Description
30-Minute Working Time – Pot life of 30 minutes at 23°C, allowing ample time for complex assemblies and precise positioning 
High Bonding Strength – Tensile shear strength of 17.5-17.6 MPa on steel; excellent adhesion to metals, ceramics, and hard plastics 
Solvent-Free & Eco-Friendly – Reactive type adhesive with no solvents; no gas generation during curing process 
Low Shrinkage – Minimal curing shrinkage ensures dimensional stability of bonded assemblies 
Excellent Durability – Superior heat resistance, chemical resistance, and water resistance 
Outstanding Insulation Properties – Excellent electrical insulation, ideal for electronic component fixing and PCB sealing 
Easy 1:1 Mixing – Simple equal-volume mixing ratio; easy to use for both professionals and DIY enthusiasts 
Room Temperature Curing – No heating required; cures naturally at ambient temperatures 
Wide Material Compatibility – Bonds metals (steel, aluminum, copper), ceramics, hard plastics, wood, glass, and FRP 
Achieves Handling Strength in 1 Hour – Time required for effective curing: approx. 1 hour at 23°C 
Japan Quality – Manufactured by CEMEDINE, a leading Japanese adhesive manufacturer with decades of expertise 
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
Sepcification
Parameter
Value
Unit
Color (Main Agent)
Pink semi-transparent
Color (Hardener)
Light yellow semi-transparent
Viscosity (Main Agent) @ 23°C
70
Pa·s
Viscosity (Hardener) @ 23°C
160
Pa·s
Density (Mixed)
1.16 - 1.17
g/cm³
Mix Ratio (by volume)
1:1
Pot Life @ 23°C
30
minutes
Handling Strength Time @ 23°C
1
hour
Full Cure Time @ 23°C
24
hours
Tensile Shear Strength (Steel)
17.5 - 17.6
MPa
Tensile Shear Strength (Copper)
19.8
MPa
Tensile Shear Strength (Stainless Steel)
16.3
MPa
Tensile Shear Strength (Aluminum)
10.2
MPa
Tensile Shear Strength (Melamine Board)
43.1
MPa
Tensile Shear Strength (Plywood)
47.1*
MPa
T-peel Strength
0.47
N/mm
Hardness (Shore D)
82
Glass Transition Temperature
43
°C
Water Absorption
2.3
%
Volume Resistivity
3.8×10¹¹
Ω·cm
Packaging Options
320ml set, 1kg set, 3kg set, 15kg pail
Shelf Life (unopened)
12
months
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
Application Scope
Automotive Industry
Adhesion of car, vehicle, vessel and aircraft parts; structural bonding 
Electronics & Electrical
Adhesion and sealing of electric equipment and electronic parts; PCB potting and component fixing 
Construction
Adhesion of composite members used for construction work 
Precision Equipment
Assembly of precision equipment, instruments, and artworks 
Sports Equipment
Adhesion of sporting equipment and recreational products 
Metal Bonding
Bonding steel, aluminum, copper, stainless steel 
Ceramics & Hard Plastics
Bonding ceramic parts, hard PVC, FRP, melamine decorative boards 
Woodworking
Bonding plywood, furniture repair 
General Industrial
Assembly of components, maintenance and repair 
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
How to use
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
Surface Preparation:
Clean the bonding surfaces thoroughly – remove oil, grease, dust, rust, and other contaminants 
For best results, roughen glossy surfaces with sandpaper to improve adhesion
Ensure surfaces are dry before application
Mixing:
Dispense equal volumes of Main Agent (Pink) and Hardener (Light Yellow) 
Mix thoroughly until a uniform color is achieved (approximately 30-60 seconds)
Do not mix more than can be used within the pot life (30 minutes at 23°C) 
Application:
Apply the mixed adhesive to one or both surfaces
Assemble parts immediately after application
Apply firm pressure and fix in place
For best results, clamp or tape parts until initial set
Curing:
Pot life: 30 minutes at 23°C 
Handling strength: 1 hour at 23°C 
Full cure: 24 hours at 23°C 
Note: Lower temperatures extend curing time; higher temperatures accelerate curing
Storage:
Store in a cool, dry place away from direct sunlight
Recommended storage temperature: 5°C to 25°C
Keep containers tightly sealed when not in use
Shelf life: 12 months from manufacturing date when stored properly 
Safety Precautions:
Use in well-ventilated areas
Avoid contact with eyes and skin; wear protective gloves
If adhesive contacts skin, wash immediately with soap and water
If adhesive enters eyes, rinse with plenty of water and seek medical attention
Keep out of reach of children
Dispose of according to local environmental regulations
Company Profile
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
E-ASIA is a leading professional supplier on adhesives. 
We specialize in a wide range of products:
Adhesives: epoxy, polyurethane, and silicone-based sealants, engineered for superior bonding strength and versatility in industrial, automotive, and construction applications.
Our commitment to excellence is encapsulated in our guiding philosophy: "Quality Primacy, High Reputation; Service Supremacy, Win-Win." This philosophy permeates every aspect of our operations, from product development to customer service. 
Customer feedback
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
Recommend products
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
Xqh382 Japan Cemedine Ep330 Fast Curing Epoxy Resin Adhesive 320ml 1: 1 Mix Ratio Solvent-Free Heat Resistant for Automotive Electronics
FAQ
Q1: What is CEMEDINE EP330?
A1: EP330 is a two-component, room temperature curing epoxy adhesive manufactured by CEMEDINE, a leading Japanese adhesive company. It features a 30-minute working time and high bonding strength .
Q2: What materials can CEMEDINE EP330 bond?
A2: EP330 bonds a wide range of materials including metals (steel, aluminum, copper, stainless steel), ceramics, hard plastics, wood, glass, FRP, and melamine boards .
Q3: How long does it take to cure?
A3: At 23°C, pot life is 30 minutes, handling strength is achieved in 1 hour, and full cure is achieved in 24 hours .
Q4: What is the mixing ratio?
A4: The mixing ratio is 1:1 by volume. Dispense equal amounts of Main Agent (pink) and Hardener (light yellow) .
Q5: Is this adhesive solvent-free?
A5: Yes, CEMEDINE EP330 is a solvent-free reactive type adhesive. No gas is generated during the curing process .
Q6: What is the shear strength of EP330?
A6: The tensile shear strength is approximately 17.5-17.6 MPa on steel, 19.8 MPa on copper, and up to 47.1 MPa on plywood (material failure) .
Q7: What packaging sizes are available?
A7: EP330 is available in 320ml sets, 1kg sets, 3kg sets, and 15kg pails .
Q8: What is the shelf life of this product?
A8: When stored properly in original sealed containers in a cool, dry place, the shelf life is 12 months .
Q9: Can EP330 be used for electrical applications?
A9: Yes, EP330 has excellent insulation properties (volume resistivity: 3.8×10¹¹ Ω·cm) and is suitable for fixing electronic components and PCB sealing .

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