Xxt21 Konishi SL220W Rapid Curing / Multi-Purpose Adhesive for Electronic and Electrical Components

• Customization: Available
• Application: Automobile, Construction, Packing
• Bonding Function: Structural Adhesive
• Model NO.: SL220W
• Color: White
• Composition: Silane Polymer
• Morphology: Paste
• Model: SL220W
• Capacity: 120ml
• Cure Type: Room Temperature Moisture Curing
• Features: High Flexibility, Impact Resistant
• Shelf Life: 12 Months
• Viscosity: 90~200 PA
• Specification: 120ML
• Trademark: KONISHI
• Origin: Japan
• Production Capacity: 10000000PCS

Product Description

Product Description

Brand	Konishi
Model	SL220W
Capacity	120ML
Color	White
Viscosit	90-200pa
Shelf Life	12 months

Application Scope 

Suitable for bonding various materials, including hard plastics such as polycarbonate 
and ABS resin, as well as metal materials. It is also applicable for bonding hard materials 
with different thermal expansion coefficients.

Product Features 

- One-component room-temperature curing elastic adhesive. 
- Does not use the 6 substances specified by ROHS (cadmium, lead, mercury, 
hexavalent chromium and its compounds, PBB, PBDE).

Konishi Japan SL220W

- Rapid hardening. 

- No use of tin compounds. 

- Liquid room-temperature curing elastic adhesive. 

- Does not use the 6 substances specified by ROHS (cadmium, lead, mercury, 
hexavalent chromium and its compounds, PBBs, PBDEs). 

- No polysiloxane: free of low-molecular cyclic 
polysiloxane that causes contact damage. 

- Can also be used for filling and bonding (internal curing requires time). 

- As it is an elastic body, the bonded parts have little deformation 
and are resistant to thermal shock.

Application Scope

Applicable Scenarios 

It can be used for bonding various materials such as polycarbonate, 

ABS resin, etc. It is suitable for bonding hard plastic materials and metal 
materials. It is suitable for bonding that requires initial bonding strength, 
bonding between hard materials with different thermal expansion coefficients, 
and bonding of parts that are easily subject to impact and vibration.

FAQ

Q: What colour and consistency is this adhesive?

A: The adhesive is a white paste. It is a single-component adhesive that is ready to use straight from the tube and requires no prior mixing.

Q: How long does this adhesive take to cure? What is the curing method?

A: It is a room-temperature, moisture-curing adhesive that requires no heating and cures quickly. It dries to the touch rapidly at room temperature, whilst full cure typically takes 24–48 hours, depending on ambient temperature and humidity.

Q: Is this a two-part adhesive? Does it need to be mixed in specific proportions before use?

A: No, it is not a two-part adhesive. It is a single-component adhesive that requires no prior mixing or proportioning; simply open the tube and use it straight away for convenient application.

Q: Does this adhesive comply with environmental standards? Will it pass RoHS testing?

A: This adhesive complies with the requirements of the EU RoHS Directive and does not contain any of the six hazardous substances regulated by RoHS (cadmium, lead, mercury, hexavalent chromium and its compounds, PBB, PBDE); Furthermore, it utilises a tin-free formulation, contains no tin compounds or polysiloxane components, and does not produce low-molecular-weight cyclic siloxanes that can cause poor contact in electronic components, making it fully compliant with the environmental regulations of the electronics industry.

Q: What are the properties of the adhesive after curing? Is it resistant to vibration and temperature fluctuations?

A: Once cured, the adhesive forms an elastomer with minimal deformation of the bonded parts. It is resistant to thermal shock, impact and vibration, making it highly suitable for bonding components subject to vibration and temperature fluctuations, whilst also offering excellent filling properties.

Q: What are the key differences between this electronics-specific adhesive and standard all-purpose adhesives?

A: The key difference lies in its customisation for electronic applications:1.It contains no low-molecular-weight cyclic siloxanes, thus preventing contact faults, short circuits and other issues in electronic components;2. It complies with RoHS environmental standards and meets the compliance requirements for industrial electronics;3. It can bond dissimilar materials with different coefficients of thermal expansion; once cured, it forms an elastomer that is vibration-resistant and resistant to thermal shock, making it suitable for the operating conditions of electronic equipment;1. It is a single-component product requiring no mixing, and is suitable for both industrial and manual applications.