Xqh450 Japan Cemedine Ep001K Two-Part Epoxy Elastomer 200% Elongation Impact Resistant for Electronic Potting Vibration Damping

Product Description

Product Description

High Peel Strength – Outstanding peel adhesion strength of 5.1 N/mm, making it resistant to peeling forces that would cause conventional epoxies to fail 

Excellent for Dissimilar Materials – Ideal for bonding materials with different linear expansion coefficients (e.g., metal to plastic, glass to metal), as the elastic bond absorbs thermal stress 

Wide Temperature Range – Maintains stable performance from -60°C to +120°C, with glass transition temperature of -65°C, ensuring flexibility even at low temperatures 

Siloxane Free Formula – Contains no low molecular weight cyclosiloxane (D3 to D10), preventing electrical contact failures and short circuits in electronic applications 

1:1 Easy Mix Ratio – Simple equal-volume mixing, no complex measurement required, easy to use for both professionals and DIY enthusiasts 

Room Temperature Curing – No heating required; cures naturally at ambient temperatures within 24 hours 

Low Outgassing – Suitable for precision optics and aerospace applications where contamination must be avoided

Good Electrical Insulation – Volume resistivity of 4.1×10¹¹ Ω·cm, suitable for electronic potting and PCB coating applications 

Sepcification

Parameter	Main Agent	Hardener	Mixed	Unit
Appearance	Milky white	Light yellow	Translucent	—
Base Material	Epoxy resin	Silyl terminated polyether	—	—
Viscosity @ 23°C	14	18	—	Pa·s
Density @ 23°C	1.15	1.00	—	g/cm³
Non-volatile Content	99	97	—	%
Mix Ratio (by volume)	1	1	—	—
Pot Life @ 23°C	—	—	10-20	min
Set Time @ 23°C	—	—	40	min
Time to Practical Strength @ 23°C	—	—	24	hours
Full Cure @ 23°C	—	—	7	days
Tensile Shear Strength (Steel)	—	—	6.15-7.57	MPa
T-Peel Strength	—	—	3.85-5.1	N/mm
Hardness	—	—	72 (Shore A)	—
Tensile Strength at Break	—	—	6.7	MPa
Elongation at Break	—	—	200	%
Glass Transition Temperature (Tg)	—	—	-65	°C
Service Temperature Range	—	—	-60 to +120	°C
Elastic Modulus	—	—	3.2	MPa
Water Absorption	—	—	1.8	%
Volume Resistivity	—	—	4.1×10¹¹	Ω·cm
Packaging	160ml	160ml	320ml/set	—
Shelf Life	—	—	12	months
Country of Origin	Japan	Japan	Japan	—

Application Scope

Electronics
PCB conformal coating, sensor encapsulation, electrical part potting, power supply sealing, circuit board protection 
Plastic, Metal, Ceramic
Automotive
Vibration damping bonding, electronic module assembly, sensor attachment, interior trim bonding
Metal, Plastic, Glass
Aerospace
Precision component bonding, low outgassing applications, optical instrument assembly 
Composite, Metal, Glass
Optics & Precision Instruments
Glass lens bonding, optical fiber fixing, precision equipment assembly 
Glass, Metal, Plastic
Industrial Assembly
Bonding engineering plastic components, vibration-prone part assembly, structural bonding 
Plastic, Metal, Ceramic
Construction
Building component bonding, panel attachment, thermal expansion compensation joints 
Metal, Concrete, Plastic
DIY & Crafts
Model making, craft projects, home repairs, art and craft bonding 
Wood, Plastic, Metal
Different Material Bonding
Metal to plastic, glass to metal, ceramic to plastic where linear expansion coefficients differ 
Multi-material

How to use

Mixing:

Dispense equal volumes of Main Agent (milky white) and Hardener (light yellow) 
Mix thoroughly until a uniform color and consistency is achieved (approximately 1-2 minutes)
Do not mix more than can be used within the pot life (10-20 minutes at 23°C) 
Application:

Apply the mixed adhesive to one or both surfaces using a spatula, brush, or dispensing equipment
Assemble parts within the pot life
For best results, clamp or tape parts in position until initial set (40 minutes) 
Apply uniform pressure throughout the joint area for optimal bond
Curing:

Pot life: 10-20 minutes at 23°C 
Set time: 40 minutes at 23°C 
Time to practical strength: 24 hours at 23°C 
Full cure: 7 days at 23°C (or 23°C × 3 days + 50°C × 3 days for faster full cure) 
Note: Lower temperatures extend curing time; higher temperatures accelerate curing
Important Notes:

This is a two-component adhesive – do not use unmixed components
Cures by chemical reaction, not by solvent evaporation
For applications requiring high thermal cycle resistance, consider heat curing (50°C × 3 days) for optimal crosslinking 
Cleanup:

Uncured adhesive: clean tools and surfaces with MEK, or other suitable solvents before curing 
Cured adhesive: must be cut or abraded away
Storage:

Store in original sealed containers in a cool, dry place away from direct sunlight
Recommended storage temperature: 5°C to 35°C
Keep containers tightly sealed when not in use
Shelf life: 12 months from manufacturing date when stored properly 
Safety Precautions:

Use in well-ventilated areas
Avoid contact with eyes and skin; wear protective gloves and glasses
If adhesive contacts skin, wash immediately with soap and water
If adhesive enters eyes, rinse with plenty of water and seek medical attention
Keep out of reach of children
Dispose of according to local environmental regulations

Company Profile

E-ASIA is a leading professional supplier on adhesives. 
We specialize in a wide range of products:
Adhesives: epoxy, polyurethane, and silicone-based sealants, engineered for superior bonding strength and versatility in industrial, automotive, and construction applications.
Our commitment to excellence is encapsulated in our guiding philosophy: "Quality Primacy, High Reputation; Service Supremacy, Win-Win." This philosophy permeates every aspect of our operations, from product development to customer service. 

Customer feedback

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FAQ

Q1: What is CEMEDINE EP001K?
A1: EP001K is a two-component, room-temperature curing epoxy adhesive that cures to a flexible, elastic state. Unlike traditional brittle epoxy resins, it features 200% elongation and high peel strength, making it ideal for vibration damping and bonding dissimilar materials .

Q2: What materials can CEMEDINE EP001K bond?
A2: It bonds a wide range of materials including metals (steel, aluminum, stainless steel), engineering plastics , ceramics, glass, and composites. It is especially effective for difficult-to-bond engineering plastics .

Q3: What is the mixing ratio?
A3: The mixing ratio is 1:1 by volume. Dispense equal amounts of Main Agent (milky white) and Hardener (light yellow) .

Q4: How long does it take to cure?
A4: At 23°C, pot life is 10-20 minutes, set time is 40 minutes, practical strength is achieved in 24 hours, and full cure is achieved in 7 days. Heat curing (50°C × 3 days) can accelerate full cure .

Q5: What is the temperature resistance?
A5: The cured adhesive maintains stable performance from -60°C to +120°C, with a glass transition temperature of -65°C, ensuring flexibility even at low temperatures .

Q6: Is EP001K suitable for bonding different materials?
A6: Yes, this is one of its key advantages. The elastic bond absorbs stress caused by different linear expansion coefficients between materials like metal and plastic, preventing bond failure under thermal cycling .

Q7: Is this adhesive siloxane-free?
A7: Yes, EP001K contains no low molecular weight cyclosiloxane (D3 to D10), making it safe for electronic applications where silicone contamination could cause electrical contact failures .

Q8: What packaging sizes are available?
A8: EP001K is available in 320ml sets (160ml main agent + 160ml hardener), 2kg sets (1kg + 1kg), and 20kg sets for industrial use .